Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Material | Beryllium Copper |
Mount | Through Hole |
Mounting Type | Through Hole |
Contact Shape | Circular |
Insulation Material | Liquid Crystal Polymer (LCP) |
Operating Temperature | -55°C~105°C |
Packaging | Bulk |
Published | 2013 |
Series | SL |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
Connector Type | Receptacle |
Number of Positions | 22 |
Number of Rows | 1 |
Additional Feature | LOW PROFILE |
Fastening Type | Push-Pull |
Contact Finish - Mating | Tin |
MIL Conformance | NO |
DIN Conformance | NO |
IEC Conformance | NO |
Filter Feature | NO |
Contact Type | Female Socket |
Mixed Contacts | NO |
Option | GENERAL PURPOSE |
Terminal Pitch | 2.54mm |
Insulation Height | 0.050 1.27mm |
Style | Board to Board |
Number of Positions Loaded | All |
Pitch - Mating | 0.100 2.54mm |
Insulation Color | Black |
Contact Length - Post | 0.082 2.08mm |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |