SLE 55R04 P-MCC2-2-1
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | M2.2 Chip Card Module |
| Supplier Device Package | M2.2 Chip Card Module |
| Packaging | Tape & Reel (TR) |
| Published | 2001 |
| Part Status | Discontinued |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Applications | Security |
| Base Part Number | SLE55R04 |
| RoHS Status | Non-RoHS Compliant |
SLE 55R04 P-MCC2-2-1 Overview
The outstanding performance of Security makes it an excellent choice.A space-saving advantage is that it is included in the M2.2 Chip Card Module package.A Surface Mount mounting method is used.There is a Tape & Reel (TR) package available for it.Based on its base part number of SLE55R04, other similarly-sized components can be found.
SLE 55R04 P-MCC2-2-1 Features
M2.2 Chip Card Module package
Mounting type of Surface Mount
SLE 55R04 P-MCC2-2-1 Applications
There are a lot of Infineon Technologies SLE 55R04 P-MCC2-2-1 Microcontroller applications.
- Printers
- Graphic terminals
- Refrigerators
- Mobile computers
- Blenders
- Entertainment-radios, CD players, televisions
- Paper shredders
- Embedded gateways
- Answering machines
- Fire alarms
