Parameters |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount |
Package / Case |
Die |
Supplier Device Package |
Wafer |
Operating Temperature |
-25°C~85°C |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Applications |
Security |
Voltage - Supply |
2.7V~5.5V |
Interface |
ISO/IEC 14443 for both Type A and Type B |
RAM Size |
2.25K x 8 |
Core Processor |
8051 |
Program Memory Type |
EEPROM (8kB) |
RoHS Status |
Non-RoHS Compliant |
SLE66CL80PENBZZZA1 Overview
In terms of performance, it is an excellent choice for Security.There is a Die package available to save space.Surface Mount is the way to mount it.Devices with 8051 core processors are available.During work, the temperature should remain at -25°C~85°C.The type of memory in which this program is stored is EEPROM (8kB).The 2.7V~5.5V supply voltage enables high efficiency.
SLE66CL80PENBZZZA1 Features
Die package
Mounting type of Surface Mount
SLE66CL80PENBZZZA1 Applications
There are a lot of Infineon Technologies SLE66CL80PENBZZZA1 Microcontroller applications.
- Virtual reality VR robots
- Graphic terminals
- Washing machine
- Fire alarms
- Paper shredders
- Digital set-top boxes
- Microwave ovens
- Binding machines
- Robots
- Communication-bluetooth, Wi-Fi, radio