Parameters |
Factory Lead Time |
1 Week |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
Die |
Number of Pins |
8 |
Supplier Device Package |
Wafer |
Operating Temperature |
-25°C~70°C |
Packaging |
Tape & Reel (TR) |
Series |
my-d™ NFC |
Part Status |
Discontinued |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Applications |
Security |
Interface |
ISO14443-3 Type A, NFC Forum Type 2 |
RoHS Status |
ROHS3 Compliant |
SLE66R16PMCC8IXHSA1 Overview
Its outstanding performance makes it a great choice for Security.As a result, it is available in the Die package.Surface Mount is used for mounting.You can find it in the package of Tape & Reel (TR).Working at -25°C~70°C temperature is recommended.This electrical component is part of the my-d? NFC series.For its construction, 8 pins are used.As a result, it is mounted in accordance with Surface Mount.
SLE66R16PMCC8IXHSA1 Features
Die package
Mounting type of Surface Mount
SLE66R16PMCC8IXHSA1 Applications
There are a lot of Infineon Technologies SLE66R16PMCC8IXHSA1 Microcontroller applications.
- Automatic control
- Electrocardiogram (EKG)
- Information appliances (networking of household appliances)
- Industrial instrumentation devices
- Security systems
- Safety -airbags, automatic braking system (ABS)
- Ipod
- X-ray
- Nintendo
- Washing machines