Parameters | |
---|---|
Factory Lead Time | 1 Week |
Weight | 15g |
Packaging | Jar |
Published | 2015 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | Not Applicable |
Type | Solder Paste, Two Part Mix |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Shelf Life | 24 Months |
Storage/Refrigeration Temperature | 37°F~77°F 3°C~25°C |
Shelf Life Start | Date of Manufacture |
Form | Jar, 0.53 oz (15g) |
Process | Lead Free |
Melting Point | 423°F~428°F 217°C~220°C |
Flux Type | No-Clean |
Height | 57.15mm |
Length | 63.5mm |
Width | 63.5mm |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |