Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Surface Mount |
Package / Case | 2-VDFN Exposed Pad |
Number of Pins | 3 |
Diode Element Material | SILICON |
Operating Temperature | -40°C~150°C TA |
Packaging | Cut Tape (CT) |
Published | 2010 |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Additional Feature | LOW DISTORTION |
HTS Code | 8541.10.00.80 |
Subcategory | PIN Diodes |
Technology | POSITIVE-INTRINSIC-NEGATIVE |
Terminal Position | DUAL |
Terminal Form | C BEND |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 40 |
Base Part Number | SMP1302-085 |
Pin Count | 3 |
JESD-30 Code | S-PDSO-C2 |
Number of Elements | 1 |
Max Current Rating | 1.5A |
Power Dissipation-Max | 3W |
Element Configuration | Common Anode |
Diode Type | PIN - Single |
Power Dissipation | 3W |
Case Connection | CATHODE |
Forward Current | 200mA |
Application | ATTENUATOR; SWITCHING |
Forward Voltage | 800mV |
Capacitance @ Vr, F | 0.35pF @ 30V 1MHz |
Reverse Voltage | 200V |
Reverse Voltage (DC) | 200V |
Frequency Band | HIGH FREQUENCY TO C B |
Diode Capacitance-Nom | 0.35pF |
Resistance @ If, F | 1.5Ohm @ 100mA 100MHz |
Minority Carrier Lifetime-Nom | 0.7 μs |
Diode Res Test Current | 100mA |
Diode Res Test Frequency | 100MHz |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |