Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Package / Case | 2-VDFN Exposed Pad |
Number of Pins | 2 |
Diode Element Material | SILICON |
Operating Temperature | -55°C~175°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2011 |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
Termination | SMD/SMT |
ECCN Code | EAR99 |
Terminal Finish | Tin (Sn) |
HTS Code | 8541.10.00.80 |
Technology | POSITIVE-INTRINSIC-NEGATIVE |
Terminal Form | C BEND |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 40 |
Base Part Number | SMP1324-087 |
Pin Count | 2 |
Number of Elements | 1 |
Max Current Rating | 200mA |
Power Dissipation-Max | 2W |
Element Configuration | Single |
Diode Type | PIN - Single |
Power Dissipation | 2W |
Case Connection | CATHODE |
Forward Current | 100mA |
Application | ATTENUATOR; SWITCHING |
Forward Voltage | 900mV |
Capacitance @ Vr, F | 1.5pF @ 30V 1MHz |
Reverse Voltage (DC) | 200V |
Resistance @ If, F | 750mOhm @ 50mA 100MHz |
Diode Capacitance-Max | 1.5pF |
Minority Carrier Lifetime-Nom | 6 μs |
Diode Forward Resistance-Max | 0.75Ohm |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |