Parameters |
Mounting Type |
Surface Mount |
Package / Case |
64-TQFP |
Surface Mount |
YES |
Operating Temperature |
0°C~70°C |
Packaging |
Tray |
Series |
74ACT |
JESD-609 Code |
e4 |
Pbfree Code |
yes |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
64 |
Terminal Finish |
NICKEL PALLADIUM GOLD |
Technology |
CMOS |
Voltage - Supply |
4.5V~5.5V |
Terminal Position |
QUAD |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Supply Voltage |
5V |
Terminal Pitch |
0.5mm |
JESD-30 Code |
S-PQFP-G64 |
Function |
Synchronous |
Current - Supply (Max) |
400μA |
Qualification Status |
COMMERCIAL |
Supply Voltage-Max (Vsup) |
5.5V |
Supply Voltage-Min (Vsup) |
4.5V |
Memory Size |
18K 2K x 9 |
Access Time |
18ns |
Data Rate |
40MHz |
Organization |
2KX9 |
Memory Width |
9 |
Memory Density |
18432 bit |
Parallel/Serial |
PARALLEL |
Bus Directional |
Uni-Directional |
Retransmit Capability |
No |
Programmable Flags Support |
Yes |
Output Enable |
YES |
Expansion Type |
Depth, Width |
Cycle Time |
25 ns |
Height Seated (Max) |
1.2mm |
Length |
10mm |
Width |
10mm |
RoHS Status |
ROHS3 Compliant |
SN74ACT7807-25PAG Overview
64-TQFP is the package in which FIFO memory chip is contained.In the shape of a Tray , it's packaged.The FIFO chips have a memory of 18K 2K x 9 that can be used to store applications and data.Reliable operation requires a temperature of 0°C~70°C .The FIFO memory's mounting type is Surface Mount .This FIFO products operates at 4.5V~5.5V volts.It is a member of the 74ACT series .There is a maximum operating current of 400μA in memory IC's supply.An input voltage of 5V results in high efficiency.I found that it has 64 terminations in FIFO means.Voltage FIFO memory IC's maximum is set to 5.5V .Keep the supply voltage (Vsup) above 4.5V for normal operation.
SN74ACT7807-25PAG Features
18K 2K x 9 memory size
74ACT series
SN74ACT7807-25PAG Applications
There are a lot of Rochester Electronics, LLC SN74ACT7807-25PAG FIFOs Memory applications.
- Address mapping
- General Data Collection Applications at Low-Temperatures
- Smart Meter
- SPI Bus Flash Memory Devices
- One assembly
- Extended product-change notification
- General Data Collection Applications at Extreme High-Temperatures
- Portable Information Devices
- Code converters
- Network bridges