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SN74AUC2G07YEPR

BUFFER


  • Manufacturer: Rochester Electronics, LLC
  • Nocochips NO: 699-SN74AUC2G07YEPR
  • Package: 6-XFBGA, DSBGA
  • Datasheet: PDF
  • Stock: 946
  • Description: BUFFER(Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 6-XFBGA, DSBGA
Surface Mount YES
Operating Temperature -40°C~85°C TA
Packaging Tape & Reel (TR)
Series 74AUC
JESD-609 Code e0
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 6
Terminal Finish TIN LEAD
Technology CMOS
Voltage - Supply 0.8V~2.7V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 2
Supply Voltage 1.2V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 6
JESD-30 Code R-XBGA-B6
Output Type Open Drain
Number of Elements 2
Supply Voltage-Min (Vsup) 0.8V
Family AUC
Number of Inputs 1
Current - Output High, Low - 9mA
Logic Type Buffer, Non-Inverting
Number of Bits per Element 1
Height Seated (Max) 0.5mm
Width 0.9mm
RoHS Status Non-RoHS Compliant
See Relate Datesheet

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