Parameters | |
---|---|
Mounting Type | Surface Mount |
Package / Case | 6-XFBGA, DSBGA |
Surface Mount | YES |
Operating Temperature | -40°C~125°C TA |
Packaging | Tape & Reel (TR) |
Series | 74LVC |
JESD-609 Code | e0 |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 6 |
Terminal Finish | TIN LEAD |
Technology | CMOS |
Voltage - Supply | 1.65V~5.5V |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 260 |
Number of Functions | 2 |
Supply Voltage | 3.3V |
Terminal Pitch | 0.5mm |
Reach Compliance Code | unknown |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Pin Count | 6 |
JESD-30 Code | R-XBGA-B6 |
Output Type | Open Drain |
Number of Elements | 2 |
Supply Voltage-Max (Vsup) | 5.5V |
Family | LVC/LCX/Z |
Number of Inputs | 1 |
Current - Output High, Low | - 32mA |
Logic Type | Buffer, Non-Inverting |
Number of Bits per Element | 1 |
Propagation Delay (tpd) | 8.6 ns |
Height Seated (Max) | 0.5mm |
Width | 0.9mm |
RoHS Status | Non-RoHS Compliant |