Parameters | |
---|---|
Shape | Rectangular |
Packaging | Tape & Reel (TR) |
Published | 2012 |
Series | SiSonic™ SP |
Size / Dimension | 0.132Lx0.098W 3.35mmx2.50mm |
JESD-609 Code | e4 |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
Termination | Solder Pads |
Type | MEMS (Silicon) |
Terminal Finish | GOLD OVER NICKEL |
Max Operating Temperature | 100°C |
Min Operating Temperature | -40°C |
Voltage - Rated | 3.6V |
HTS Code | 8542.39.00.01 |
Terminal Form | UNSPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Number of Functions | 1 |
Depth | 1.08mm |
Reach Compliance Code | unknown |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | R-XBCC-X3 |
Output Type | Analog |
Operating Supply Voltage | 3.6V |
Supply Voltage-Min (Vsup) | 1.5V |
Operating Supply Current | 160μA |
Impedance | 400Ohm |
Direction | Omnidirectional |
Voltage Range | 1.5V~3.6V |
Frequency Range | 100Hz~15kHz |
Signal to Noise Ratio (SNR) | 63 dB |
Sensitivity | -38dB ±3dB @ 94dB SPL |
Port Location | Bottom |
Height | 1.08mm |
Length | 3.35mm |
Width | 2.5mm |
RoHS Status | RoHS Compliant |