Parameters |
Mounting Type |
Surface Mount |
Package / Case |
196-LBGA |
Supplier Device Package |
196-MAPBGA (15x15) |
Operating Temperature |
-40°C~105°C TJ |
Packaging |
Tray |
Published |
2005 |
Series |
DSP56K/Symphony |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Type |
Fixed Point |
Base Part Number |
SPAKDSP311 |
Interface |
Host Interface, SSI, SCI |
Voltage - I/O |
3.30V |
Non-Volatile Memory |
ROM (576B) |
Voltage - Core |
1.80V |
On Chip Data RAM |
384kB |
Clock Rate |
150MHz |
RoHS Status |
ROHS3 Compliant |
SPAKDSP311VL150 Overview
It is a type of electronic component available in package 196-LBGA.Tray is the packaging method provided.Fixed Point members are well suited for a wide range of applications.The mounting of the device is done in the direction of Surface Mount.The operation of the device at the temperature of -40°C~105°C TJ ensures the normal operation of the device.The digital voltage range of 3.30V refers to the voltage that can be input or output.The DSP56K/Symphony series includes this digital signal processor.The base part number SPAKDSP311 can be used to identify many associated parts.
SPAKDSP311VL150 Features
Supplied in the 196-LBGA package
SPAKDSP311VL150 Applications
There are a lot of NXP USA Inc. SPAKDSP311VL150 DSP applications.
- Digital communications
- Audio synthesis
- Spectral density estimation
- Telephone conversations
- Biomedical engineering
- Automatic analysis system of EEG or ECG
- Video coding, audio coding
- Sonar
- Computers and laptop
- Medical imaging