Parameters | |
---|---|
Gate Charge (Qg) (Max) @ Vgs | 187nC @ 10V |
Rise Time | 53ns |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 32 ns |
Turn-Off Delay Time | 54 ns |
Continuous Drain Current (ID) | 80A |
Gate to Source Voltage (Vgs) | 20V |
Max Dual Supply Voltage | 55V |
Drain-source On Resistance-Max | 0.0077Ohm |
Drain to Source Breakdown Voltage | 55V |
Avalanche Energy Rating (Eas) | 700 mJ |
RoHS Status | Non-RoHS Compliant |
Lead Free | Contains Lead |
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | TO-263-3, D2Pak (2 Leads + Tab), TO-263AB |
Number of Pins | 3 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~175°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2004 |
Series | SIPMOS® |
JESD-609 Code | e3 |
Part Status | Discontinued |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Terminal Finish | Tin (Sn) |
Voltage - Rated DC | 55V |
Technology | MOSFET (Metal Oxide) |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Reach Compliance Code | not_compliant |
Current Rating | 80A |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | R-PSSO-G2 |
Number of Elements | 1 |
Power Dissipation-Max | 300W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 300W |
Case Connection | DRAIN |
Turn On Delay Time | 22 ns |
FET Type | N-Channel |
Rds On (Max) @ Id, Vgs | 7.7m Ω @ 80A, 10V |
Vgs(th) (Max) @ Id | 4V @ 240μA |
Halogen Free | Halogen Free |
Input Capacitance (Ciss) (Max) @ Vds | 3660pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 80A Tc |