Parameters | |
---|---|
Mount | Through Hole |
Mounting Type | Through Hole |
Package / Case | TO-251-3 Stub Leads, IPak |
Number of Pins | 3 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tube |
Published | 2005 |
Series | CoolMOS™ |
JESD-609 Code | e3 |
Pbfree Code | no |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
Termination | Through Hole |
Terminal Finish | Matte Tin (Sn) |
Additional Feature | AVALANCHE RATED |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Pin Count | 3 |
Qualification Status | Not Qualified |
Number of Elements | 1 |
Power Dissipation-Max | 25W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 25W |
Turn On Delay Time | 6 ns |
FET Type | N-Channel |
Rds On (Max) @ Id, Vgs | 3 Ω @ 1.1A, 10V |
Vgs(th) (Max) @ Id | 3.9V @ 80μA |
Input Capacitance (Ciss) (Max) @ Vds | 200pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 1.8A Tc |
Gate Charge (Qg) (Max) @ Vgs | 12.5nC @ 10V |
Rise Time | 3ns |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 12 ns |
Turn-Off Delay Time | 68 ns |
Continuous Drain Current (ID) | 1.8A |
Gate to Source Voltage (Vgs) | 20V |
Max Dual Supply Voltage | 600V |
Drain-source On Resistance-Max | 3Ohm |
Drain to Source Breakdown Voltage | 650V |
Pulsed Drain Current-Max (IDM) | 5.4A |
Dual Supply Voltage | 650V |
Avalanche Energy Rating (Eas) | 50 mJ |
Nominal Vgs | 3 V |
REACH SVHC | Unknown |
RoHS Status | RoHS Compliant |
Lead Free | Lead Free |