Parameters | |
---|---|
Pin Count | 3 |
Factory Lead Time | 1 Week |
Mounting Type | Through Hole |
Package / Case | TO-251-3 Short Leads, IPak, TO-251AA |
Surface Mount | NO |
JESD-30 Code | R-PSIP-T3 |
Transistor Element Material | SILICON |
Qualification Status | Not Qualified |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tube |
Number of Elements | 1 |
Published | 2003 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Power Dissipation-Max | 38W Tc |
Series | CoolMOS™ |
Operating Mode | ENHANCEMENT MODE |
JESD-609 Code | e3 |
FET Type | N-Channel |
Pbfree Code | no |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 1.4 Ω @ 2A, 10V |
Vgs(th) (Max) @ Id | 3.9V @ 135μA |
Part Status | Last Time Buy |
Input Capacitance (Ciss) (Max) @ Vds | 400pF @ 25V |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Current - Continuous Drain (Id) @ 25°C | 3.2A Tc |
Number of Terminations | 3 |
Gate Charge (Qg) (Max) @ Vgs | 17nC @ 10V |
Terminal Finish | Tin (Sn) |
Drain to Source Voltage (Vdss) | 650V |
Additional Feature | AVALANCHE RATED |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Technology | MOSFET (Metal Oxide) |
Vgs (Max) | ±20V |
Drain Current-Max (Abs) (ID) | 3.2A |
Pulsed Drain Current-Max (IDM) | 9.6A |
Terminal Position | SINGLE |
DS Breakdown Voltage-Min | 600V |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Avalanche Energy Rating (Eas) | 100 mJ |
RoHS Status | ROHS3 Compliant |
Reach Compliance Code | not_compliant |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |