Parameters |
Mounting Type |
Surface Mount |
Package / Case |
160-TFBGA |
Surface Mount |
YES |
Operating Temperature |
0°C~70°C |
Packaging |
Tray |
Published |
2004 |
JESD-609 Code |
e0 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
160 |
Terminal Finish |
Tin/Lead (Sn/Pb) |
HTS Code |
8542.39.00.01 |
Subcategory |
Other Logic ICs |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
240 |
Number of Functions |
1 |
Supply Voltage |
1.7V~1.9V |
Terminal Pitch |
0.65mm |
Time@Peak Reflow Temperature-Max (s) |
20 |
Base Part Number |
74SSTU32865 |
Pin Count |
160 |
JESD-30 Code |
R-PBGA-B160 |
Qualification Status |
Not Qualified |
Power Supplies |
1.8V |
Number of Bits |
28 |
Output Characteristics |
OPEN-DRAIN |
Logic Type |
1:2 Registered Buffer with Parity |
Output Polarity |
TRUE |
Trigger Type |
POSITIVE EDGE |
Propagation Delay (tpd) |
2.15 ns |
fmax-Min |
270 MHz |
Height Seated (Max) |
1.2mm |
Length |
13mm |
Width |
9mm |
RoHS Status |
ROHS3 Compliant |
SSTU32865ET,557 Overview
Packages are made with Tray.There is a copy of it in the 160-TFBGA package.The voltage of 1.7V~1.9V is supplied to make sure that the device is able to operate normally.It is a type of electronic part mounted in the manner of Surface Mount.This device operates at a temperature of 0°C~70°C.Approximately 28 bits of information can be stored in the memory.Its base part number 74SSTU32865 identifies a number of related parts.There are 160 pins on all component boards.160 terminations reduce the likelihood of signals reflecting off the end of a transmission line.Other Logic ICs is a subcategory of it.The power supplies of 1.8V should be maintained for convenient use.
SSTU32865ET,557 Features
SSTU32865ET,557 Applications
There are a lot of NXP USA Inc. SSTU32865ET,557 Specialty Logic ICs applications.
- Fiber-to-the-desktop
- Switches/bridges/routers/servers
- LAN, SAN, WAN (local, storage, work area networks)
- Wireless access points
- IP cameras
- Metro access rings
- 1x/2x Fiber Channel
- Data center
- Laser diode bonding
- Point-to-point networking