Parameters |
Terminal Pitch |
0.65mm |
Time@Peak Reflow Temperature-Max (s) |
30 |
Base Part Number |
74SSTU32865 |
Pin Count |
160 |
JESD-30 Code |
R-PBGA-B160 |
Qualification Status |
Not Qualified |
Number of Bits |
28 |
Output Characteristics |
OPEN-DRAIN |
Logic Type |
1:2 Registered Buffer with Parity |
Output Polarity |
TRUE |
Trigger Type |
POSITIVE EDGE |
Propagation Delay (tpd) |
2.15 ns |
fmax-Min |
270 MHz |
Height Seated (Max) |
1.2mm |
Length |
13mm |
Width |
9mm |
RoHS Status |
ROHS3 Compliant |
Mounting Type |
Surface Mount |
Package / Case |
160-TFBGA |
Surface Mount |
YES |
Operating Temperature |
0°C~70°C |
Packaging |
Tray |
Published |
2004 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
160 |
HTS Code |
8542.39.00.01 |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
260 |
Number of Functions |
1 |
Supply Voltage |
1.7V~1.9V |
SSTU32865ET/G,551 Overview
A packaging method that uses Tray is employed.It is included in package 160-TFBGA.In order to ensure that the device will work normally, the voltage 1.7V~1.9V is supplied.As a type of electronic component, it uses the Surface Mount mounting method.In terms of its operating temperature, it is set at 0°C~70°C.Using the memory, information is stored in 28 bits.In addition to its base part number 74SSTU32865, other related parts are available.It adds up to 160 when all component pins are added together.With 160 terminations, signals won't reflect off the end of the transmission line.
SSTU32865ET/G,551 Features
SSTU32865ET/G,551 Applications
There are a lot of NXP USA Inc. SSTU32865ET/G,551 Specialty Logic ICs applications.
- Solenoids
- Remote controls
- Bar, KTV wireless entertainment
- Indoor ad hoc meeting
- Changeing the frequency from IF to RF
- interconnection between switches
- Lamps
- Wireless showroom
- Switching system
- Cell phones