Parameters |
Mounting Type |
Surface Mount |
Package / Case |
96-LFBGA |
Surface Mount |
YES |
Operating Temperature |
0°C~70°C |
Packaging |
Tray |
Published |
2007 |
JESD-609 Code |
e0 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
96 |
Terminal Finish |
Tin/Lead (Sn/Pb) |
HTS Code |
8542.39.00.01 |
Subcategory |
Other Logic ICs |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Number of Functions |
1 |
Supply Voltage |
1.7V~2V |
Terminal Pitch |
0.8mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Base Part Number |
74SSTUA32864 |
Pin Count |
96 |
JESD-30 Code |
R-PBGA-B96 |
Qualification Status |
Not Qualified |
Power Supplies |
1.8V |
Number of Bits |
25, 14 |
Logic Type |
1:1, 1:2 Configurable Registered Buffer |
Output Polarity |
TRUE |
Trigger Type |
POSITIVE EDGE |
Propagation Delay (tpd) |
1.8 ns |
fmax-Min |
450 MHz |
Height Seated (Max) |
1.5mm |
Length |
13.5mm |
Width |
5.5mm |
RoHS Status |
ROHS3 Compliant |
SSTUA32864EC,557 Overview
Packing is accomplished by using Tray.There is a copy of it in the 96-LFBGA package.Providing a voltage of 1.7V~2V ensures proper function of the device.It is a type of electronic part mounted in the manner of Surface Mount.Temperature 0°C~70°C is set as operating temperature.Using a size of 25, 14 bits, the memory stores data.Its base part number 74SSTUA32864 identifies a number of related parts.A total of 96 pins are present on the component.The 96 terminations prevent signal reflection off the transmission line.It belongs to the Other Logic ICs subcategory.The power supplies of 1.8V should be maintained for convenient use.
SSTUA32864EC,557 Features
SSTUA32864EC,557 Applications
There are a lot of NXP USA Inc. SSTUA32864EC,557 Specialty Logic ICs applications.
- Fiber distributed data interface (FDDI)
- transmission relay
- Remote controls
- IP cameras
- Wireless modems
- Wireless access points
- Car radio
- Single to Multimode Fiber Conversion
- Optical sub-assembly (OSA)
- Precision engineering measurement