SSTUA32S865ET,557
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 160-TFBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~70°C |
| Packaging | Tray |
| Published | 2007 |
| JESD-609 Code | e0 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 160 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Other Logic ICs |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Number of Functions | 1 |
| Supply Voltage | 1.7V~2V |
| Terminal Pitch | 0.65mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Base Part Number | 74SSTUA32S865 |
| Pin Count | 160 |
| JESD-30 Code | R-PBGA-B160 |
| Qualification Status | Not Qualified |
| Power Supplies | 1.8V |
| Number of Bits | 28 |
| Output Characteristics | OPEN-DRAIN |
| Logic Type | 1:2 Registered Buffer with Parity |
| Output Polarity | TRUE |
| Trigger Type | POSITIVE EDGE |
| Propagation Delay (tpd) | 1.8 ns |
| fmax-Min | 450 MHz |
| Height Seated (Max) | 1.2mm |
| Length | 13mm |
| Width | 9mm |
| RoHS Status | ROHS3 Compliant |
SSTUA32S865ET,557 Overview
In packaging, Tray is used.You can find it in the 160-TFBGA package.To ensure normal operation of the device, 1.7V~2V is supplied.As a type of electronic component, it uses the Surface Mount mounting method.This device operates at a temperature of 0°C~70°C.Information can be stored in the memory at the rate of 28 bits.Using the base part number 74SSTUA32S865, it is possible to locate a number of related parts.In total, there are 160 pins on the component.160 terminations reduce the likelihood of signals reflecting off the end of a transmission line.It belongs to the Other Logic ICs subcategory.Maintaining the power supplies of 1.8V is essential for convenient operation.
SSTUA32S865ET,557 Features
SSTUA32S865ET,557 Applications
There are a lot of NXP USA Inc. SSTUA32S865ET,557 Specialty Logic ICs applications.
- Indoor ad hoc meeting
- Satellite communication
- Low power, low voltage systems
- Wireless access points
- Cordless telephone
- 1x/2x Fiber Channel
- Fiber-to-the-desktop
- Vehicle, ship, aircraft navigation and positioning
- Structural bonding
- Wireless transmission
