SSTUA32S865ET/G,55
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 160-TFBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~70°C |
| Packaging | Tray |
| Published | 2007 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 160 |
| HTS Code | 8542.39.00.01 |
| Subcategory | Other Logic ICs |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Supply Voltage | 1.7V~2V |
| Terminal Pitch | 0.65mm |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Base Part Number | 74SSTUA32S865 |
| Pin Count | 160 |
| JESD-30 Code | R-PBGA-B160 |
| Qualification Status | Not Qualified |
| Power Supplies | 1.8V |
| Number of Bits | 28 |
| Output Characteristics | OPEN-DRAIN |
| Logic Type | 1:2 Registered Buffer with Parity |
| Output Polarity | TRUE |
| Trigger Type | POSITIVE EDGE |
| Propagation Delay (tpd) | 1.8 ns |
| fmax-Min | 450 MHz |
| Height Seated (Max) | 1.2mm |
| Length | 13mm |
| Width | 9mm |
| RoHS Status | ROHS3 Compliant |
SSTUA32S865ET/G,55 Overview
Packages are made with Tray.You can find it in the 160-TFBGA package.For the device to function normally, voltage 1.7V~2V is supplied.It is a type of electronic part mounted in the way of Surface Mount.It operates at a temperature of 0°C~70°C.Information is stored in the memory with a size of 28 bits.On the basis of its base part number 74SSTUA32S865, you can find a number of related parts.160 is the sum of all component pins.Using 160 terminations, signals are prevented from reverberating off the end of the transmission line.It can be categorized under Other Logic ICs.For ease of use, it is recommended that the power supplies of 1.8V be maintained.
SSTUA32S865ET/G,55 Features
SSTUA32S865ET/G,55 Applications
There are a lot of NXP USA Inc. SSTUA32S865ET/G,55 Specialty Logic ICs applications.
- Satellite communications networks
- TV signal transmission
- Digital systems
- Ethernet circuitry
- Fast Ethernet
- Wireless transmission
- Changeing the frequency from IF to RF
- Laser diode bonding
- Thermal management
- Wireless interactive experience
