Parameters | |
---|---|
Factory Lead Time | 1 Week |
Lifecycle Status | ACTIVE (Last Updated: 8 months ago) |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | TO-263-3, D2Pak (2 Leads + Tab), TO-263AB |
Number of Pins | 3 |
Transistor Element Material | SILICON |
Operating Temperature | 150°C TJ |
Packaging | Cut Tape (CT) |
Series | MDmesh™ V |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Resistance | 139MOhm |
Terminal Finish | Matte Tin (Sn) - annealed |
Additional Feature | AVALANCHE ENERGY RATED |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | 245 |
Time@Peak Reflow Temperature-Max (s) | 30 |
Base Part Number | STB30N |
Pin Count | 4 |
JESD-30 Code | R-PSSO-G2 |
Number of Elements | 1 |
Power Dissipation-Max | 140W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 140W |
Turn On Delay Time | 50 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 139m Ω @ 11A, 10V |
Vgs(th) (Max) @ Id | 5V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 2880pF @ 100V |
Current - Continuous Drain (Id) @ 25°C | 22A Tc |
Gate Charge (Qg) (Max) @ Vgs | 64nC @ 10V |
Rise Time | 8ns |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Vgs (Max) | ±25V |
Fall Time (Typ) | 10 ns |
Turn-Off Delay Time | 50 ns |
Continuous Drain Current (ID) | 22A |
Gate to Source Voltage (Vgs) | 25V |
Drain to Source Breakdown Voltage | 650V |
Pulsed Drain Current-Max (IDM) | 88A |
Avalanche Energy Rating (Eas) | 500 mJ |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |