Parameters | |
---|---|
Lifecycle Status | ACTIVE (Last Updated: 7 months ago) |
Rds On (Max) @ Id, Vgs | 4.8 Ω @ 1A, 10V |
Mount | Surface Mount |
Vgs(th) (Max) @ Id | 4.5V @ 50μA |
Mounting Type | Surface Mount |
Input Capacitance (Ciss) (Max) @ Vds | 280pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 2A Tc |
Package / Case | TO-252-3, DPak (2 Leads + Tab), SC-63 |
Number of Pins | 3 |
Gate Charge (Qg) (Max) @ Vgs | 15nC @ 10V |
Rise Time | 30ns |
Transistor Element Material | SILICON |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Vgs (Max) | ±30V |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Fall Time (Typ) | 50 ns |
Series | SuperMESH™ |
Turn-Off Delay Time | 13 ns |
Continuous Drain Current (ID) | 2A |
JESD-609 Code | e3 |
JEDEC-95 Code | TO-252AA |
Gate to Source Voltage (Vgs) | 30V |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Drain Current-Max (Abs) (ID) | 2A |
Drain to Source Breakdown Voltage | 600V |
Number of Terminations | 2 |
Pulsed Drain Current-Max (IDM) | 8A |
ECCN Code | EAR99 |
Radiation Hardening | No |
Resistance | 4.8Ohm |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Terminal Finish | Matte Tin (Sn) - annealed |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 30 |
Base Part Number | STD2HNK |
Pin Count | 3 |
JESD-30 Code | R-PSSO-G2 |
Number of Elements | 1 |
Power Dissipation-Max | 45W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 45W |
Turn On Delay Time | 10 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Factory Lead Time | 1 Week |