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STGB15H60DF

Trans IGBT Chip N-CH 600V 30A 3-Pin D2PAK T/R


  • Manufacturer: STMicroelectronics
  • Nocochips NO: 761-STGB15H60DF
  • Package: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
  • Datasheet: PDF
  • Stock: 461
  • Description: Trans IGBT Chip N-CH 600V 30A 3-Pin D2PAK T/R (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Lifecycle Status ACTIVE (Last Updated: 7 months ago)
Mount Surface Mount
Mounting Type Surface Mount
Package / Case TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
Number of Pins 3
Weight 2.000002g
Operating Temperature -55°C~175°C TJ
Packaging Cut Tape (CT)
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Max Power Dissipation 115W
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number STGB15
Element Configuration Single
Input Type Standard
Power - Max 115W
Collector Emitter Voltage (VCEO) 600V
Max Collector Current 30A
Reverse Recovery Time 103 ns
Collector Emitter Breakdown Voltage 600V
Collector Emitter Saturation Voltage 1.6V
Max Breakdown Voltage 600V
Test Condition 400V, 15A, 10 Ω, 15V
Vce(on) (Max) @ Vge, Ic 2V @ 15V, 15A
IGBT Type Trench Field Stop
Gate Charge 81nC
Current - Collector Pulsed (Icm) 60A
Td (on/off) @ 25°C 24.5ns/118ns
Switching Energy 136μJ (on), 207μJ (off)
Height 4.6mm
Length 10.4mm
Width 9.35mm
RoHS Status ROHS3 Compliant
See Relate Datesheet

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