Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Through Hole |
Mounting Type | Through Hole |
Package / Case | TO-262-3 Long Leads, I2Pak, TO-262AA |
Number of Pins | 3 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tube |
Series | MDmesh™ II Plus |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
ECCN Code | EAR99 |
Technology | MOSFET (Metal Oxide) |
Base Part Number | STI24N |
Number of Elements | 1 |
Power Dissipation-Max | 150W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Case Connection | DRAIN |
Turn On Delay Time | 14 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 190m Ω @ 9A, 10V |
Vgs(th) (Max) @ Id | 4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 1060pF @ 100V |
Current - Continuous Drain (Id) @ 25°C | 18A Tc |
Gate Charge (Qg) (Max) @ Vgs | 29nC @ 10V |
Rise Time | 9ns |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Vgs (Max) | ±25V |
Fall Time (Typ) | 15 ns |
Turn-Off Delay Time | 60 ns |
Continuous Drain Current (ID) | 18A |
Gate to Source Voltage (Vgs) | 25V |
Drain-source On Resistance-Max | 0.19Ohm |
Drain to Source Breakdown Voltage | 600V |
Pulsed Drain Current-Max (IDM) | 72A |
Avalanche Energy Rating (Eas) | 180 mJ |
Height | 9.35mm |
Length | 10.4mm |
Width | 4.6mm |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |