Parameters | |
---|---|
Factory Lead Time | 1 Week |
Lifecycle Status | ACTIVE (Last Updated: 6 months ago) |
Mounting Type | Surface Mount |
Package / Case | 64-LQFP |
Surface Mount | YES |
Number of Pins | 64 |
Operating Temperature | -40°C~105°C TA |
Packaging | Tray |
Series | STM32F1 |
JESD-609 Code | e4 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 64 |
ECCN Code | EAR99 |
Terminal Finish | NICKEL PALLADIUM GOLD |
Subcategory | Microcontrollers |
Max Power Dissipation | 444mW |
Technology | CMOS |
Terminal Position | QUAD |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | 260 |
Supply Voltage | 3V |
Terminal Pitch | 0.5mm |
Frequency | 24MHz |
Time@Peak Reflow Temperature-Max (s) | 30 |
Base Part Number | STM32F100 |
Pin Count | 64 |
Interface | I2C, IrDA, LIN, SPI, UART, USART |
Memory Size | 64kB |
Oscillator Type | Internal |
Number of I/O | 51 |
RAM Size | 8K x 8 |
Voltage - Supply (Vcc/Vdd) | 2V~3.6V |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
Core Processor | ARM® Cortex®-M3 |
Peripherals | DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT |
Program Memory Type | FLASH |
Core Size | 32-Bit |
Program Memory Size | 64KB 64K x 8 |
Connectivity | I2C, IrDA, LINbus, SPI, UART/USART |
Bit Size | 32 |
Data Converter | A/D 16x12b; D/A 2x12b |
Watchdog Timer | Yes |
Has ADC | YES |
DMA Channels | YES |
Data Bus Width | 32b |
Number of Timers/Counters | 7 |
Core Architecture | ARM |
CPU Family | CORTEX-M3 |
Number of ADC Channels | 16 |
Number of PWM Channels | 6 |
Number of I2C Channels | 2 |
Height | 1.4mm |
Length | 10mm |
Width | 10mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
The STM32F100x4, STM32F100x6, STM32F100x8 and STM32F100xB microcontrollers incorporate the high-performance ARM? Cortex?-M3 32-bit RISC core operating at a 24 MHz frequency, high-speed embedded memories (Flash memory up to 128 Kbytes and SRAM up to 8 Kbytes), and an extensive range of enhanced peripherals and I/Os connected to two APB buses. All devices offer standard communication interfaces (up to two I2Cs, two SPIs, one HDMI CEC, and up to three USARTs), one 12-bit ADC, two 12-bit DACs, up to six general-purpose 16-bit timers and an advanced-control PWM timer. The STM32F100xx low- and medium-density devices operate in the – 40 to + 85 °C and – 40 to + 105 °C temperature ranges, from a 2.0 to 3.6 V power supply.
? Core: ARM? 32-bit Cortex?-M3 CPU
– 24 MHz maximum frequency,
1.25 DMIPS/MHz (Dhrystone 2.1)
performance
– Single-cycle multiplication and hardware
division
? Memories
– 16 to 128 Kbytes of Flash memory
– 4 to 8 Kbytes of SRAM
? Clock, reset and supply management
– 2.0 to 3.6 V application supply and I/Os
– POR, PDR and programmable voltage
detector (PVD)
– 4-to-24 MHz crystal oscillator
– Internal 8 MHz factory-trimmed RC
– Internal 40 kHz RC
– PLL for CPU clock
– 32 kHz oscillator for RTC with calibration
? Low power
– Sleep, Stop and Standby modes
– VBAT supply for RTC and backup registers
? Debug mode
– Serial wire debug (SWD) and JTAG
interfaces
? DMA
– 7-channel DMA controller
– Peripherals supported: timers, ADC, SPIs,
I
2Cs, USARTs and DACs
? 1 × 12-bit, 1.2 μs A/D converter (up to 16
channels)
– Conversion range: 0 to 3.6 V
– Temperature sensor
? 2 × 12-bit D/A converters
? Up to 80 fast I/O ports
– 37/51/80 I/Os, all mappable on 16 external
interrupt vectors and almost all 5 V-tolerant
Low-power modes
Voltage regulator