Parameters | |
---|---|
Factory Lead Time | 1 Week |
Lifecycle Status | ACTIVE (Last Updated: 6 months ago) |
Mounting Type | Surface Mount |
Package / Case | 100-LQFP |
Surface Mount | YES |
Number of Pins | 100 |
Operating Temperature | -40°C~85°C TA |
Packaging | Tray |
Series | STM32F1 |
JESD-609 Code | e4 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 100 |
Termination | SMD/SMT |
Terminal Finish | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
Subcategory | Microcontrollers |
Max Power Dissipation | 434mW |
Technology | CMOS |
Terminal Position | QUAD |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | 250 |
Supply Voltage | 3.3V |
Terminal Pitch | 0.5mm |
Frequency | 36MHz |
Base Part Number | STM32F101 |
Pin Count | 100 |
Supply Voltage-Min (Vsup) | 2V |
Interface | I2C, IrDA, LIN, SPI, UART, USART |
Memory Size | 512kB |
Oscillator Type | Internal |
Number of I/O | 80 |
RAM Size | 48K x 8 |
Voltage - Supply (Vcc/Vdd) | 2V~3.6V |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
Number of Bits | 32 |
Core Processor | ARM® Cortex®-M3 |
Peripherals | DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT |
Program Memory Type | FLASH |
Core Size | 32-Bit |
Program Memory Size | 512KB 512K x 8 |
Connectivity | I2C, IrDA, LINbus, SPI, UART/USART |
Bit Size | 32 |
Data Converter | A/D 16x12b; D/A 2x12b |
Watchdog Timer | Yes |
Has ADC | YES |
DMA Channels | YES |
Data Bus Width | 32b |
Number of Timers/Counters | 6 |
Address Bus Width | 32b |
Density | 4 Mb |
Core Architecture | ARM |
Number of ADC Channels | 1 |
Number of PWM Channels | 16 |
Number of I2C Channels | 2 |
Number of SPI Channels | 3 |
Height | 1.45mm |
Length | 14mm |
Width | 14.2mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
The STM32F101xC, STM32F101xD, and STM32F101xE access line family incorporates the high-performance ARM? Cortex?-M3 32-bit RISC core operating at a 36 MHz frequency, high-speed embedded memories (Flash memory up to 512 Kbytes and SRAM up to 48 Kbytes), and an extensive range of enhanced I/Os and peripherals connected to two APB buses. All devices offer one 12-bit ADC, four general-purpose 16-bit timers, as well as standard and advanced communication interfaces: up to two I2Cs, three SPIs, and five USARTs. The STM32F101xx high-density access line family operates in the –40 to +85 °C temperature range, from a 2.0 to 3.6 V power supply. A comprehensive set of power-saving modes allows for the design of low-power applications.
Core: ARM? 32-bit Cortex?-M3 CPU
– 36 MHz maximum frequency,
1.25 DMIPS/MHz (Dhrystone 2.1)
performance
– Single-cycle multiplication and hardware
division
Memories
– 256 to 512 Kbytes of Flash memory
– up to 48 Kbytes of SRAM
– Flexible static memory controller with 4
Chip Select. Supports Compact Flash,
SRAM, PSRAM, NOR and NAND
memories
– LCD parallel interface, 8080/6800 modes
Clock, reset, and supply management
– 2.0 to 3.6 V application supply and I/Os
– POR, PDR, and programmable voltage
detector (PVD)
– 4-to-16 MHz crystal oscillator
– Internal 8 MHz factory-trimmed RC
– Internal 40 kHz RC with calibration
capability
– 32 kHz oscillator for RTC with calibration
Low power
– Sleep, Stop and Standby modes
– VBAT supply for RTC and backup registers
1 x 12-bit, 1 μs A/D converters (up to 16
channels)
– Conversion range: 0 to 3.6 V
– Temperature sensor
2 × 12-bit D/A converters