Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mounting Type | Through Hole |
Package / Case | TO-3P-3 Full Pack |
Surface Mount | NO |
Diode Element Material | SILICON |
Packaging | Tube |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
ECCN Code | EAR99 |
Additional Feature | SOFT FACTOR IS 2.2 |
Terminal Position | SINGLE |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Base Part Number | STTH31 |
JESD-30 Code | R-PSFM-T3 |
Operating Temperature (Max) | 175°C |
Number of Elements | 1 |
Configuration | SINGLE |
Speed | Fast Recovery =< 500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 10μA @ 600V |
Voltage - Forward (Vf) (Max) @ If | 2V @ 30A |
Case Connection | ISOLATED |
Operating Temperature - Junction | 175°C Max |
Output Current-Max | 30A |
Application | HIGH VOLTAGE ULTRA FAST SOFT RECOVERY |
Voltage - DC Reverse (Vr) (Max) | 600V |
Current - Average Rectified (Io) | 30A |
Number of Phases | 1 |
Reverse Recovery Time | 65ns |
Rep Pk Reverse Voltage-Max | 600V |
Non-rep Pk Forward Current-Max | 150A |
Reverse Current-Max | 10μA |
RoHS Status | ROHS3 Compliant |