Parameters | |
---|---|
Gate Charge (Qg) (Max) @ Vgs | 106nC @ 10V |
Lifecycle Status | NRND (Last Updated: 8 months ago) |
Contact Plating | Tin |
Mount | Through Hole |
Rise Time | 15ns |
Mounting Type | Through Hole |
Package / Case | TO-247-3 |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Number of Pins | 3 |
Weight | 9.071847g |
Transistor Element Material | SILICON |
Vgs (Max) | ±30V |
Operating Temperature | 150°C TJ |
Packaging | Tube |
Series | MDmesh™ |
Fall Time (Typ) | 19 ns |
JESD-609 Code | e3 |
Turn-Off Delay Time | 13 ns |
Part Status | Not For New Designs |
Continuous Drain Current (ID) | 30A |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Threshold Voltage | 3V |
Number of Terminations | 3 |
ECCN Code | EAR99 |
Gate to Source Voltage (Vgs) | 30V |
Resistance | 120mOhm |
Drain Current-Max (Abs) (ID) | 26A |
Subcategory | FET General Purpose Power |
Drain to Source Breakdown Voltage | 500V |
Voltage - Rated DC | 500V |
Technology | MOSFET (Metal Oxide) |
Avalanche Energy Rating (Eas) | 740 mJ |
Max Junction Temperature (Tj) | 150°C |
Current Rating | 30A |
Base Part Number | STW26N |
Height | 24.45mm |
Pin Count | 3 |
Length | 15.75mm |
Number of Elements | 1 |
Width | 5.15mm |
Number of Channels | 1 |
Radiation Hardening | No |
Power Dissipation-Max | 313W Tc |
REACH SVHC | No SVHC |
Element Configuration | Single |
RoHS Status | ROHS3 Compliant |
Operating Mode | ENHANCEMENT MODE |
Lead Free | Lead Free |
Power Dissipation | 313W |
Turn On Delay Time | 28 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 120m Ω @ 13A, 10V |
Vgs(th) (Max) @ Id | 5V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 3000pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 30A Tc |