Parameters | |
---|---|
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 30 |
Pin Count | 4 |
JESD-30 Code | R-PSSO-G2 |
Number of Elements | 1 |
Power Dissipation-Max | 3W Ta 136W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 3W |
Case Connection | DRAIN |
Mount | Surface Mount |
Turn On Delay Time | 8 ns |
FET Type | N-Channel |
Mounting Type | Surface Mount |
Rds On (Max) @ Id, Vgs | 25m Ω @ 40A, 10V |
Package / Case | TO-252-3, DPak (2 Leads + Tab), SC-63 |
Vgs(th) (Max) @ Id | 3V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 2400pF @ 25V |
Number of Pins | 3 |
Transistor Element Material | SILICON |
Current - Continuous Drain (Id) @ 25°C | 40A Tc |
Gate Charge (Qg) (Max) @ Vgs | 60nC @ 10V |
Operating Temperature | -55°C~175°C TJ |
Rise Time | 40ns |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Packaging | Tape & Reel (TR) |
Vgs (Max) | ±20V |
Fall Time (Typ) | 80 ns |
Turn-Off Delay Time | 15 ns |
Continuous Drain Current (ID) | 40A |
Threshold Voltage | 3V |
JEDEC-95 Code | TO-252AA |
Published | 2014 |
Gate to Source Voltage (Vgs) | 20V |
Drain to Source Breakdown Voltage | 100V |
Series | TrenchFET® |
Pulsed Drain Current-Max (IDM) | 70A |
Avalanche Energy Rating (Eas) | 80 mJ |
Nominal Vgs | 3 V |
JESD-609 Code | e3 |
Radiation Hardening | No |
REACH SVHC | No SVHC |
Pbfree Code | yes |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Resistance | 25mOhm |
Terminal Finish | Matte Tin (Sn) - with Nickel (Ni) barrier |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |