Parameters | |
---|---|
Mounting Type | Chassis Mount |
Surface Mount | NO |
Diode Element Material | SILICON |
Series | SMT |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 1 |
ECCN Code | EAR99 |
Type | Laminated Core |
HTS Code | 8541.10.00.50 |
Technology | ZENER |
Terminal Form | UNSPECIFIED |
Pin Count | 1 |
Termination Style | Solder, Quick Connect |
JESD-30 Code | O-MUPM-X1 |
Number of Elements | 1 |
Polarity | UNIDIRECTIONAL |
Power Dissipation-Max | 5W |
Case Connection | ISOLATED |
Power - Max | 1000VA |
Rep Pk Reverse Voltage-Max | 7.5V |
Non-rep Peak Rev Power Dis-Max | 1000W |
Primary Winding(s) | Dual |
Center Tap | No |
Breakdown Voltage-Min | 8.19V |
Secondary Winding(s) | Single |
Breakdown Voltage-Max | 10.01V |
Height Seated (Max) | 143.00mm |
RoHS Status | RoHS Compliant |