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TDA18264HB/C1E

Telecom device16 Circuits


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-TDA18264HB/C1E
  • Package: 80-TFQFN Exposed Pad
  • Datasheet: -
  • Stock: 889
  • Description: Telecom device16 Circuits(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Mounting Type Surface Mount
Package / Case 80-TFQFN Exposed Pad
Published 2016
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Power (Watts) 2.55W
Function Transceiver
Number of Circuits 16
RoHS Status ROHS3 Compliant

TDA18264HB/C1E Overview


The 80-TFQFN Exposed Pad package reduces the amount of space on a board.In this case, Surface Mount is the mounting type.An 16-circuit makes up this telecom IC .

TDA18264HB/C1E Features


Available in the 80-TFQFN Exposed Pad package

TDA18264HB/C1E Applications


There are a lot of NXP USA Inc. TDA18264HB/C1E Telecom applications.

  • Channel Service Units (CSUs): T1/E1/J1
  • Digital loop carrier (DLC)
  • T3 channelized access concentrators
  • Wireless Local Loop
  • CSU/DSU E1/T1/J1 Interface
  • Integrated Access Devices (IADs)
  • Codec function on telephone switch line cards
  • Interfaces to SONET STS-1 Networks
  • Digital Modems
  • SDH Multiplexers

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