Parameters | |
---|---|
Mount | Surface Mount |
Package / Case | Module |
Number of Pins | 8 |
Operating Temperature | -25°C~85°C |
Packaging | Tape & Reel (TR) |
Published | 2012 |
JESD-609 Code | e3 |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
Number of Terminations | 8 |
Terminal Finish | MATTE TIN |
Power Rating | 500mW |
Max Power Dissipation | 500mW |
Technology | CMOS |
Voltage - Supply | 2.4V~5.5V |
Terminal Position | SINGLE |
Orientation | Side View |
Terminal Form | L BEND |
Peak Reflow Temperature (Cel) | 260 |
Number of Functions | 1 |
Supply Voltage | 3.3V |
Terminal Pitch | 1mm |
Time@Peak Reflow Temperature-Max (s) | 40 |
Pin Count | 8 |
Nominal Supply Current | 2mA |
Forward Current | 10mA |
Data Rate | 4Mbs (FIR) |
Size | 9.7mmx4.7mmx4.0mm |
Rise Time | 40ns |
Fall Time (Typ) | 40 ns |
Wavelength - Peak | 886 nm |
Interface IC Type | INTERFACE CIRCUIT |
Input Current | 10mA |
Supply Voltage1-Nom | 3.3V |
Standards | IrPHY 1.4 |
Link Range, Low Power | 1m |
Shutdown | Yes |
Height | 4.7mm |
Length | 9.9mm |
Width | 4.2mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |