TFDU6103-TT3
| Parameters | |
|---|---|
| Mount | Surface Mount |
| Package / Case | Module |
| Number of Pins | 8 |
| Operating Temperature | -25°C~85°C |
| Packaging | Tape & Reel (TR) |
| Published | 2012 |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 8 |
| Terminal Finish | Matte Tin (Sn) |
| Power Rating | 500mW |
| Technology | CMOS |
| Voltage - Supply | 2.4V~5.5V |
| Terminal Position | SINGLE |
| Orientation | Top View |
| Terminal Form | L BEND |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Pin Count | 8 |
| Nominal Supply Current | 2mA |
| Forward Current | 125mA |
| Data Rate | 4Mbs (FIR) |
| Size | 9.7mmx4.7mmx4.0mm |
| Rise Time | 40ns |
| Fall Time (Typ) | 40 ns |
| Wavelength - Peak | 886 nm |
| Interface IC Type | INTERFACE CIRCUIT |
| Supply Voltage1-Nom | 3.3V |
| Standards | IrPHY 1.4 |
| Link Range, Low Power | 1m |
| Shutdown | Yes |
| Height Seated (Max) | 4.2mm |
| Width | 4.7mm |
| Radiation Hardening | No |
| REACH SVHC | Unknown |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
See Relate Datesheet
