TFDU6300-TT1
| Parameters | |
|---|---|
| Package / Case | SMD/SMT |
| Surface Mount | YES |
| Operating Temperature | -25°C~85°C |
| Packaging | Tape & Reel (TR) |
| Published | 2013 |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 8 |
| Terminal Finish | Matte Tin (Sn) |
| HTS Code | 8542.39.00.01 |
| Technology | CMOS |
| Voltage - Supply | 2.4V~3.6V |
| Terminal Position | SINGLE |
| Orientation | Top View |
| Terminal Form | L BEND |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Pin Count | 8 |
| JESD-30 Code | R-XSMA-L8 |
| Operating Supply Voltage | 3.6V |
| Data Rate | 4Mbs (FIR) |
| Size | 8.5mmx3.1mmx2.5mm |
| Rise Time | 40ns |
| Fall Time (Typ) | 40 ns |
| Interface IC Type | INTERFACE CIRCUIT |
| Wavelength | 886 nm |
| Standards | IrPHY 1.3 |
| Idle Current, Typ @ 25°C | 2mA |
| Link Range, Low Power | 70cm |
| Shutdown | Yes |
| Height | 3.1mm |
| Length | 8.5mm |
| Width | 2.5mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
See Relate Datesheet
