Parameters |
Mounting Type |
Surface Mount |
Package / Case |
64-LQFP |
Surface Mount |
YES |
Operating Temperature |
0°C~70°C |
Packaging |
Tube |
JESD-609 Code |
e0 |
Pbfree Code |
no |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
64 |
Type |
Stereo Audio |
Terminal Finish |
TIN LEAD |
Terminal Position |
QUAD |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Number of Functions |
1 |
Terminal Pitch |
0.5mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Pin Count |
64 |
JESD-30 Code |
S-PQFP-G64 |
Qualification Status |
COMMERCIAL |
Supply Voltage-Max (Vsup) |
5.25V |
Supply Voltage-Min (Vsup) |
4.75V |
Data Interface |
SPI |
Voltage - Supply, Analog |
4.75V~5.25V |
Voltage - Supply, Digital |
4.75V~5.25V |
Resolution (Bits) |
16 b |
Sigma Delta |
Yes |
Height Seated (Max) |
1.6mm |
Length |
10mm |
Width |
10mm |
RoHS Status |
Non-RoHS Compliant |
TLC320AD80CPM Overview
Due to space constraints, it is supplied in the 64-LQFP package. As a packaging method, Tube is adopted. In the various applications in which this electronic part is used, it is capable of delivering a high level of efficiency as a type of Stereo Audio. The mounting type of this device is Surface Mount. At 0°C~70°C, it can operate normally. Supply voltage 4.75V~5.25V is provided to the analog circuit. The digital circuit is provided with the supply voltage of 4.75V~5.25V. To prevent signals from reflecting off of the transmission line, there are 64 terminations. The board is configured with 64 pins. In addition, it can be supplied with a voltage of 4.75V at a minimum. Supply voltages up to 5.25V are supported.
TLC320AD80CPM Features
Embedded in the 64-LQFP package
Operating temperature of 0°C~70°C
TLC320AD80CPM Applications
There are a lot of Rochester Electronics, LLC TLC320AD80CPM CODECs Interface ICs applications.
- Radiation therapy
- Electronics industry
- Switching function
- Metal forming & fabrication
- Textiles
- Addition
- Filling
- Ball screw positioning
- Pulp & paper mills
- Semiconductor fabrication