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TLE7237GS

Hot Swap Controllers SSOP


  • Manufacturer: Infineon Technologies
  • Nocochips NO: 376-TLE7237GS
  • Package: SSOP
  • Datasheet: PDF
  • Stock: 656
  • Description: Hot Swap Controllers SSOP (Kg)

Details

Tags

Parameters
Mount Surface Mount
Package / Case SSOP
Number of Pins 24
Pbfree Code yes
Moisture Sensitivity Level (MSL) 3
Number of Terminations 24
ECCN Code EAR99
Resistance 1.6Ohm
Max Operating Temperature 150°C
Min Operating Temperature -40°C
Subcategory Peripheral Drivers
Technology CMOS
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Pitch 0.635mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 24
Number of Outputs 8
Qualification Status Not Qualified
Max Output Current 1A
Power Supplies 3.3/5V
Max Supply Current 15mA
Current - Output 130mA
Interface IC Type BUFFER OR INVERTER BASED PERIPHERAL DRIVER
Driver Number of Bits 8
Screening Level AEC-Q100
Output Peak Current Limit-Nom 0.38A
Output Current Flow Direction SINK
RoHS Status RoHS Compliant

TLE7237GS Overview


The SSOP package includes it.Hot-swappable device has a total of 24 terminations.Device position DUAL is its terminal position.The device consists of a total of 24 pins.24 pins are used in operation.Peripheral Drivers contains this gadget on its own.The position of the object is in the direction of Surface Mount.Hot-swappable device is possible to maintain stable operation at a maximum temperature of 150°C°C.The system must function at a minimum temperature of -40°C degrees Celsius in order to maintain its reliability.Hot-swappable device has a 3.3/5V power supply, which is the power supply used in the part.As a default, it's set to output 8.1A is the maximum output current required to meet the operation criteria.Hot Swap requires a maximum current of 15mA to operate.There is 1.6Ohm resistance in the device.

TLE7237GS Features


The terminal position of 24

TLE7237GS Applications


There are a lot of Infineon Technologies TLE7237GS hot swap controllers applications.

  • Backplane
  • Redundant Array of Disks (RAID)
  • Current monitor output
  • Base station power distribution system
  • Current monitoring
  • Circuit power protectors
  • Network switch
  • Automatic restart after load failure
  • Circuit breakers for high-side circuits
  • Current limit and current foldback limit functions

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