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TLIXF30009-865852

Telecom device


  • Manufacturer: Inphi Corporation
  • Nocochips NO: 180-TLIXF30009-865852
  • Package: 868-BGA
  • Datasheet: PDF
  • Stock: 601
  • Description: Telecom device(Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 868-BGA
Supplier Device Package 868-BGA
Packaging Tray
Published 2008
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Function Optical Transport Processor
Interface 4-Bit Nibble, SFI-4.1, XSBI

TLIXF30009-865852 Overview


To save board space, the 868-BGA package is used.In order to pack telecommunications equipment, Tray is used.A Surface Mount-mount is used for mounting the telecom circuit.

TLIXF30009-865852 Features


Available in the 868-BGA package

TLIXF30009-865852 Applications


There are a lot of Inphi Corporation TLIXF30009-865852 Telecom applications.

  • DSLAMs
  • Interfaces to DS3
  • CSU/DSU E1 Interface
  • Channel Service Units (CSUs): T1/E1/J1
  • Cable Modem
  • Digital loop carrier (DLC)
  • Digital subscriber line access multiplexer (DSLAM)
  • Cable modem
  • Hybrid fiber coax (HFC)
  • Digital Cross Connect Systems

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