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TLIXF30011-865853

Telecom device


  • Manufacturer: Inphi Corporation
  • Nocochips NO: 180-TLIXF30011-865853
  • Package: 868-BGA
  • Datasheet: PDF
  • Stock: 351
  • Description: Telecom device(Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 868-BGA
Supplier Device Package 868-BGA
Packaging Tray
Published 2008
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Function Optical Transport Processor
Interface 4-Bit Nibble, SFI-4.1, XSBI

TLIXF30011-865853 Overview


868-BGA package is used to save board space.Telecommunications equipment is packed according to Tray's method.The mounting type of this telecom circuit is Surface Mount.

TLIXF30011-865853 Features


Available in the 868-BGA package

TLIXF30011-865853 Applications


There are a lot of Inphi Corporation TLIXF30011-865853 Telecom applications.

  • Cable Modem
  • E1 Network Equipment
  • ISDN Primary Rate Interfaces (PRA)
  • Interfaces to DS3
  • Fiber
  • Digital subscriber line access multiplexer (DSLAM)
  • Integrated Access Devices (IADs)
  • Channel Banks
  • Digital Access Cross-connect System (DACs)
  • PCM Test Equipment

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