Parameters |
Mount |
Surface Mount |
Package / Case |
BGA |
Number of Pins |
376 |
Max Operating Temperature |
125°C |
Min Operating Temperature |
-40°C |
Frequency |
300MHz |
Interface |
Ethernet, I2C, McASP, UART |
Max Supply Voltage |
3.63V |
Min Supply Voltage |
1.14V |
RAM Size |
64kB |
Frequency (Max) |
300MHz |
Data Bus Width |
16b |
RoHS Status |
RoHS Compliant |
TMS320DM6431ZDUQ3 Overview
The BGA package contains these electronic components.Its configuration includes 376 pins.300MHz is a frequency at which the device operates according to a specific design.Using Surface Mount as a mounting method, it is mounted.This device requires a minimum voltage of 1.14V.It is capable of receiving a maximum voltage of 3.63V.A lower operating temperature than 125°C is recommended.Temperatures should exceed -40°C during operation.The maximum value of its frequency should be kept below 300MHz.
TMS320DM6431ZDUQ3 Features
Supplied in the BGA package
TMS320DM6431ZDUQ3 Applications
There are a lot of Texas Instruments TMS320DM6431ZDUQ3 DSP applications.
- Infrared
- Smart phones
- Machinery and equipment
- Audio compression
- Geoscience signal processing
- Audio signal
- Digital image processing, data compression
- Image signal processing
- Infinite impulse response filters
- TVs