Parameters |
Package / Case |
BGA |
Surface Mount |
YES |
Pbfree Code |
no |
Number of Terminations |
256 |
ECCN Code |
3A001.A.3 |
HTS Code |
8542.31.00.01 |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Supply Voltage |
1.8V |
Terminal Pitch |
1.27mm |
Pin Count |
256 |
Supply Voltage-Max (Vsup) |
1.89V |
Supply Voltage-Min (Vsup) |
1.71V |
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER |
Clock Frequency |
150MHz |
Address Bus Width |
20 |
Boundary Scan |
YES |
Low Power Mode |
NO |
External Data Bus Width |
32 |
Format |
FIXED POINT |
Barrel Shifter |
NO |
Internal Bus Architecture |
MULTIPLE |
Height Seated (Max) |
2.32mm |
Length |
27mm |
Width |
27mm |
RoHS Status |
RoHS Compliant |
Lead Free |
Contains Lead |
TMS32C6211B1GFN150 Overview
This is an electronic component with a BGA package.There are 256 terminations for its uses.It is supplied with voltage by 1.8V.There are pins on the 256 component.This system uses DIGITAL SIGNAL PROCESSOR, OTHER as its uPs, uCs, and peripheral ICs.With a clock frequency of 150MHz, it operates.
TMS32C6211B1GFN150 Features
Supplied in the BGA package
DIGITAL SIGNAL PROCESSOR, OTHER as uPs/uCs/Peripheral Ics
TMS32C6211B1GFN150 Applications
There are a lot of Texas Instruments TMS32C6211B1GFN150 DSP applications.
- Speech processing
- Fourier transform
- Telephone conversations
- Infrared
- 3D tomography and imaging processing
- Digital hardware
- Control systems
- Vibration signal processing
- Electronic information engineering
- Audio