TMS32C6416DGLZ6E3
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 532-BFBGA, FCBGA |
| Supplier Device Package | 532-FCBGA (23x23) |
| Operating Temperature | 0°C~90°C TC |
| Packaging | Tray |
| Series | TMS320C6414/15/16 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Type | Fixed Point |
| Interface | Host Interface, McBSP, PCI, UTOPIA |
| Voltage - I/O | 3.30V |
| Non-Volatile Memory | External |
| Voltage - Core | 1.40V |
| On Chip Data RAM | 1.03MB |
| Clock Rate | 600MHz |
| RoHS Status | Non-RoHS Compliant |
TMS32C6416DGLZ6E3 Overview
It is a kind of electronic component available in the 532-BFBGA, FCBGA package.There is a packaging method of Tray provided with it.Fixed Point members are well suited for a wide range of applications.Surface Mount is mounted in a manner that allows it to be moved.It is important that the device is operated at a temperature of 0°C~90°C TC in order to ensure its normal functioning.3.30V refers to the range of analog voltages that can be input or output.TMS320C6414/15/16 series digital signal processors contain this digital signal processor.
TMS32C6416DGLZ6E3 Features
Supplied in the 532-BFBGA, FCBGA package
TMS32C6416DGLZ6E3 Applications
There are a lot of Rochester Electronics, LLC TMS32C6416DGLZ6E3 DSP applications.
- Tomography technology
- Instrument modeling
- Receivers
- Infrared
- Biomedical engineering
- Audio compression
- Voice recognition
- Speech signal processing
- Compression of videos
- Spectral density estimation
