Parameters |
Package / Case |
BGA |
Surface Mount |
YES |
Pbfree Code |
no |
Number of Terminations |
352 |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Supply Voltage |
3.3V |
Terminal Pitch |
1.27mm |
Pin Count |
352 |
Qualification Status |
Not Qualified |
Operating Temperature (Max) |
85°C |
Supply Voltage-Max (Vsup) |
3.465V |
Temperature Grade |
OTHER |
Supply Voltage-Min (Vsup) |
3.165V |
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, MIXED |
Address Bus Width |
32 |
Boundary Scan |
YES |
Low Power Mode |
NO |
External Data Bus Width |
64 |
Format |
FLOATING POINT |
Barrel Shifter |
YES |
Internal Bus Architecture |
MULTIPLE |
Height Seated (Max) |
1.7mm |
Length |
35mm |
Width |
35mm |
TMX320C82GGP Overview
It is a type of electronic component available in package BGA.Its uses have 352 terminations.A voltage of 3.3V is used as the supply voltage.Pins are available for 352 components.This device utiliDIGITAL SIGNAL PROCESSOR, MIXEDes the DIGITAL SIGNAL PROCESSOR, MIXED type of uPs, uCs, and peripheral ICs.Keeping 85°C as the maximum operating temperature is recommended.
TMX320C82GGP Features
Supplied in the BGA package
DIGITAL SIGNAL PROCESSOR, MIXED as uPs/uCs/Peripheral Ics
TMX320C82GGP Applications
There are a lot of Texas Instruments TMX320C82GGP DSP applications.
- Biomedical engineering
- Computer vision technology
- Automatic analysis system of EEG or ECG
- Smart phones
- Audio compression
- Biomedical treatment
- Geophysical processing
- Infrared
- Vibration signal processing
- Speech processing