Parameters |
Mounting Type |
Surface Mount |
Package / Case |
169-LFBGA |
Surface Mount |
YES |
Number of Pins |
169 |
Operating Temperature |
0°C~85°C TC |
Packaging |
Tray |
Series |
TMS320C54x |
JESD-609 Code |
e0 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 |
Number of Terminations |
169 |
Type |
Fixed Point |
Terminal Finish |
Tin/Lead (Sn/Pb) |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Supply Voltage |
1.6V |
Reach Compliance Code |
not_compliant |
Base Part Number |
TNETV2842 |
Pin Count |
169 |
Supply Voltage-Max (Vsup) |
1.65V |
Supply Voltage-Min (Vsup) |
1.55V |
Interface |
Host Interface, McBSP |
Boundary Scan |
YES |
Low Power Mode |
YES |
Voltage - I/O |
3.30V |
Barrel Shifter |
NO |
Internal Bus Architecture |
MULTIPLE |
Non-Volatile Memory |
External |
Voltage - Core |
1.60V |
On Chip Data RAM |
1.25MB |
Clock Rate |
133MHz |
Height |
1.4mm |
Length |
12mm |
Width |
12mm |
Thickness |
900μm |
RoHS Status |
Non-RoHS Compliant |
Lead Free |
Contains Lead |
TNETV2842VNDGGU Overview
This is an electronic component with a 169-LFBGA package.Tray packaging is provided for it.Its Fixed Point status makes it ideal for a wide range of applications.It is mounted in the way of Surface Mount.At the temperature of 0°C~85°C TC, the device is guaranteed to operate normally.The digital voltage range of 3.30V refers to the voltage that can be input or output.The TMS320C54x series contains this digital signal processor.There are 169 terminations for its uses.A voltage of 1.6V is used as the supply voltage.Pins are available for 169 components.The configuration of this board includes 169 pins.Many related parts can be identified by using the TNETV2842 part number as a base.Data format and transmission speed can be configured for asynchronous serial communication on 0 UART channels.
TNETV2842VNDGGU Features
Supplied in the 169-LFBGA package
TNETV2842VNDGGU Applications
There are a lot of Texas Instruments TNETV2842VNDGGU DSP applications.
- Speech processing and recognition
- Digital communications
- Geoscience signal processing
- Computer vision technology
- Biomedical engineering
- Smart phones
- Voice recognition
- Machinery and equipment
- Instrument modeling
- Infrared