Parameters |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Number of Functions |
1 |
Supply Voltage |
5V |
Terminal Pitch |
1.27mm |
JESD-30 Code |
R-PDSO-G16 |
Qualification Status |
COMMERCIAL |
Data Interface |
Serial |
Voltage - Supply, Analog |
4.75V~5.25V |
Voltage - Supply, Digital |
4.75V~5.25V |
Resolution (Bits) |
8 b |
Sigma Delta |
No |
Number of ADCs / DACs |
1 / 1 |
Filter |
YES |
Companding Law |
MU-LAW |
Neg Supply Voltage-Nom |
-5V |
Height Seated (Max) |
2.65mm |
Length |
10.3mm |
Width |
7.5mm |
RoHS Status |
ROHS3 Compliant |
Mounting Type |
Surface Mount |
Package / Case |
16-SOIC (0.295, 7.50mm Width) |
Surface Mount |
YES |
Operating Temperature |
-40°C~85°C |
Packaging |
Tube |
JESD-609 Code |
e4 |
Pbfree Code |
yes |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
16 |
Type |
PCM, Filter |
Terminal Finish |
NICKEL PALLADIUM GOLD |
Technology |
CMOS |
TP13054BDW Overview
In order to save space, it is packaged in the 16-SOIC (0.295, 7.50mm Width) package. Tube packaging method is used. Due to the fact that this part is of the type PCM, Filter, it is capable of delivering high-efficiency performance in a wide range of applications. As far as mounting types are concerned, it uses Surface Mount. When the operating performance is set to -40°C~85°C, it is able to operate normally. 1 / 1 ADCs and DACs are integrated into it. Supply voltage 4.75V~5.25V is provided to the analog circuit. 4.75V~5.25V is the supply voltage for the digital circuit. There are 16 terminations used to prevent signals from reflecting off the end of the transmission line. It operates with the supply voltage of 5V. The ground of the circuit is more negative in polarity than the -5V supply voltage.
TP13054BDW Features
Embedded in the 16-SOIC (0.295, 7.50mm Width) package
Operating temperature of -40°C~85°C
1 / 1 ADCs / DACs
TP13054BDW Applications
There are a lot of Rochester Electronics, LLC TP13054BDW CODECs Interface ICs applications.
- High-performance memory-decoding or data-routing applications
- Semiconductor fabrication
- Metal forming & fabrication
- Digital systems
- Microprocessor
- High-performance memory systems
- Elevators
- Flight simulators
- Stagecraft
- Filling