Parameters |
Mount |
Surface Mount |
Package / Case |
DFN |
Number of Pins |
8 |
Published |
2004 |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Terminal Finish |
Matte Tin (Sn) |
Max Operating Temperature |
125°C |
Min Operating Temperature |
-20°C |
Pin Count |
8 |
Output Type |
Digital, I2C |
Interface |
2-Wire, I2C, SMBus |
Termination Type |
SOLDER |
Operating Supply Current |
700μA |
Number of Bits |
12 |
Resolution |
1 B |
Sensors/Transducers Type |
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL |
Max Supply Voltage (DC) |
3.6V |
Min Supply Voltage (DC) |
2.3V |
Accuracy-Max |
3 Cel |
Length |
2mm |
Width |
3mm |
Thickness |
750μm |
RoHS Status |
RoHS Compliant |
Lead Free |
Lead Free |
TSE2002GB2A1NCG Overview
Its output type is Digital, I2C.Its low package cost makes it appealing to electronic industry professionals.In addition, it has 8 pins. 12 bits information can be stored.For miniming reflections and power losses, it uses SOLDER termination type.At 1 B, we can distinguish between two points on a waveform, which measures the distance in amplitude between them.Thermal management operates on 700μA current.Supply Voltage (DC) maximum is 3.6V.Thermal management operates wThermal managementh the minimum Supply Voltage (DC) of 2.3V.To avoid unnecessary costs, the Operating Temperature should not exceed 125°C. The Operating Temperature should be above -20°C to avoid uncessary cost.
TSE2002GB2A1NCG Features
Available in the DFN package
Operating supply current of 700μA
TSE2002GB2A1NCG Applications
There are a lot of Integrated Device Technology (IDT) TSE2002GB2A1NCG applications of thermal management.
- General Purpose Temperature Datalog
- Network Servers and Personal Computers
- DIMM Modules for Servers, PCs, and Laptops
- Telecomm Equipment
- Multi-processor based equipment
- Telecommunications
- Notebooks
- Graphics Cards
- Projectors
- DIMM Modules