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TSE2002GB2A1NCG

8-WFDFN Exposed Pad, CSP Thermal Management


  • Manufacturer: Renesas Electronics America Inc.
  • Nocochips NO: 668-TSE2002GB2A1NCG
  • Package: 8-WFDFN Exposed Pad, CSP
  • Datasheet: PDF
  • Stock: 292
  • Description: 8-WFDFN Exposed Pad, CSP Thermal Management (Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 8-WFDFN Exposed Pad, CSP
Operating Temperature -20°C~125°C
Packaging Tube
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Voltage - Supply 2.3V~3.6V
Base Part Number IDTTSE2002
Function Temp Monitoring System (Sensor)
Output Type I2C/SMBus
Accuracy ±2°C
Topology ADC, Register Bank
Sensor Type Internal
Output Alarm No
Sensing Temperature -20°C~125°C

TSE2002GB2A1NCG Overview


Packaged according to Tube's materials.Thermal management? uses the output type I2C/SMBus.Electronic industry professionals are familiar with the 8-WFDFN Exposed Pad, CSP because of its low package cost.The program can perform the function of Temp Monitoring System (Sensor).The device will be mounted by pressing Surface Mount.Having a Internal type, it is incorporated with.A reliable operation requires a temperature of -20°C~125°C.Supply 2.3V~3.6V Supply Voltage so it can operate normally.There is a way to measure -20°C~125°C's sensing temperature.In addition to package and temperature, the Base Part Number IDTTSE2002 identifies its Type.

TSE2002GB2A1NCG Features


Available in the 8-WFDFN Exposed Pad, CSP package

TSE2002GB2A1NCG Applications


There are a lot of Renesas Electronics America Inc. TSE2002GB2A1NCG applications of thermal management.

  • Dual In-line Memory Module (DIMM)
  • DIMM Modules
  • Projectors
  • Instrumentation
  • Networking Equipment
  • Desktop PCs
  • Telecommunications Equipment
  • Telecom Equipment
  • Telecommunications
  • Notebook Computers

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