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TSW-110-13-G-D

SAMTEC TSW-110-13-G-D Board-To-Board Connector, Vertical, TSW Series, 20 Contacts, Header, 2.54 mm, Through Hole, 2 Rows


  • Manufacturer: Samtec Inc.
  • Nocochips NO: 680-TSW-110-13-G-D
  • Package: -
  • Datasheet: PDF
  • Stock: 631
  • Description: SAMTEC TSW-110-13-G-D Board-To-Board Connector, Vertical, TSW Series, 20 Contacts, Header, 2.54 mm, Through Hole, 2 Rows (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Contact Material Phosphor Bronze
Mount Through Hole
Mounting Type Through Hole
Contact Shape Square
Insulation Material Polybutylene Terephthalate (PBT)
Operating Temperature -55°C~125°C
Packaging Bulk
Published 2005
Series TSW
JESD-609 Code e4
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Connector Type Header
Number of Positions 20
Number of Rows 2
Gender Male
Additional Feature E.L.P.
HTS Code 8536.69.40.40
Fastening Type Push-Pull
Contact Finish - Mating Gold
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Male Pin
Mixed Contacts NO
Option GENERAL PURPOSE
Insulation Height 0.100 2.54mm
Style Board to Board or Cable
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Number of Conductors ONE
Reference Standard UL
Reliability COMMERCIAL
Row Spacing - Mating 0.100 (2.54mm)
Contact Length - Post 0.900 22.86mm
Shrouding Unshrouded
Number Of PCB Rows 2
Lead Pitch 2.54mm
Contact Length - Mating 0.230 5.84mm
PCB Contact Pattern RECTANGULAR
Mating Information MULTIPLE MATING PARTS AVAILABLE
Body Breadth 0.1 inch
UL Flammability Code 94V-0
Body Depth 0.1 inch
Overall Contact Length 1.230 31.24mm
Mating Contact Pitch 0.1 inch
PCB Contact Row Spacing 5.08 mm
Plating Thickness 10μin
Contact Finish Thickness - Mating 10.0μin 0.25μm
Contact Finish Thickness - Post 3.00μin 0.076μm
Length - Termination 0.9 inch
Material Flammability Rating UL94 V-0
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
See Relate Datesheet

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