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TSXPC860SRVZQU66D

PowerPC Microprocessor TSXPC860 357-BBGA


  • Manufacturer: Microchip Technology
  • Nocochips NO: 536-TSXPC860SRVZQU66D
  • Package: 357-BBGA
  • Datasheet: PDF
  • Stock: 334
  • Description: PowerPC Microprocessor TSXPC860 357-BBGA (Kg)

Details

Tags

Parameters
Package / Case 357-BBGA
Supplier Device Package 357-PBGA (25x25)
Operating Temperature -40°C~110°C TC
Packaging Tray
Published 1997
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number TSXPC860
Speed 66MHz
Core Processor PowerPC
Voltage - I/O 3.3V
Ethernet 10/100Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
Additional Interfaces I2C, PCMCIA, SCC, SMC, SPI, UART
Co-Processors/DSP Communications; CPM
RoHS Status Non-RoHS Compliant

TSXPC860SRVZQU66D Overview


The embedded microprocessor ships overseas conveniently packed in 357-BBGA. Using advanced packaging techniques Tray, high reliability is ensured. Cores/Bus width of the CPU is 1 Core 32-Bit . Understand how the operating temperature around -40°C~110°C TC is determined. PowerPC processors are embedded in this CPU. This CPU uses DRAM RAM controllers. With its I2C, PCMCIA, SCC, SMC, SPI, UART interfaces, this microprocessor will be able to serve you better. This CPU runs I/O at 3.3V. You can search for variants of a microprocessor with TSXPC860. There is a 357-PBGA (25x25) package offered by suppliers.

TSXPC860SRVZQU66D Features


PowerPC Core

TSXPC860SRVZQU66D Applications


There are a lot of Microchip Technology TSXPC860SRVZQU66D Microprocessor applications.

  • Day to day life field
  • Telephone sets
  • Fire detection & safety devices
  • Removable disks
  • Dishwashers
  • Ipad
  • 8. Navigation control field
  • Heart rate monitors
  • Christmas lights
  • DDC control

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