Parameters |
Package / Case |
357-BBGA |
Supplier Device Package |
357-PBGA (25x25) |
Operating Temperature |
-40°C~110°C TC |
Packaging |
Tray |
Published |
1997 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
TSXPC860 |
Speed |
66MHz |
Core Processor |
PowerPC |
Voltage - I/O |
3.3V |
Ethernet |
10/100Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
Additional Interfaces |
I2C, PCMCIA, SCC, SMC, SPI, UART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
TSXPC860SRVZQU66D Overview
The embedded microprocessor ships overseas conveniently packed in 357-BBGA. Using advanced packaging techniques Tray, high reliability is ensured. Cores/Bus width of the CPU is 1 Core 32-Bit . Understand how the operating temperature around -40°C~110°C TC is determined. PowerPC processors are embedded in this CPU. This CPU uses DRAM RAM controllers. With its I2C, PCMCIA, SCC, SMC, SPI, UART interfaces, this microprocessor will be able to serve you better. This CPU runs I/O at 3.3V. You can search for variants of a microprocessor with TSXPC860. There is a 357-PBGA (25x25) package offered by suppliers.
TSXPC860SRVZQU66D Features
PowerPC Core
TSXPC860SRVZQU66D Applications
There are a lot of Microchip Technology TSXPC860SRVZQU66D Microprocessor applications.
- Day to day life field
- Telephone sets
- Fire detection & safety devices
- Removable disks
- Dishwashers
- Ipad
- 8. Navigation control field
- Heart rate monitors
- Christmas lights
- DDC control