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TWR-MCF5225X

MCF5225X, OPEN-SOURCE BDM, USB 2.0, TOWER SYSTEM MODULE; Silicon Manufacturer:NXP; Core Architecture:ColdFire; Core Sub-Architecture:ColdFire v2; Silicon Core Number:MCF52; Silicon Family Name:MCF5225x; No. of Bits:32bit ;RoHS Complia


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-TWR-MCF5225X
  • Package: -
  • Datasheet: PDF
  • Stock: 519
  • Description: MCF5225X, OPEN-SOURCE BDM, USB 2.0, TOWER SYSTEM MODULE; Silicon Manufacturer:NXP; Core Architecture:ColdFire; Core Sub-Architecture:ColdFire v2; Silicon Core Number:MCF52; Silicon Family Name:MCF5225x; No. of Bits:32bit ;RoHS Complia(Kg)

Details

Tags

Parameters
Mounting Type Fixed
Published 2008
Series ColdFire®
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type MCU 32-Bit
Core Processor Coldfire V2
Utilized IC / Part MCF5225x
Contents Board(s), Cable(s)
Board Type Evaluation Platform
Platform Tower System
RoHS Status ROHS3 Compliant
See Relate Datesheet

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