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UCC3831DWP

5 Hot Swap Controllers SOIC 5


  • Manufacturer: Texas Instruments
  • Nocochips NO: 815-UCC3831DWP
  • Package: SOIC
  • Datasheet: -
  • Stock: 910
  • Description: 5 Hot Swap Controllers SOIC 5 (Kg)

Details

Tags

Parameters
Package / Case SOIC
Surface Mount YES
Pbfree Code no
Number of Terminations 28
ECCN Code EAR99
HTS Code 8542.39.00.01
Subcategory Power Management Circuits
Technology BICMOS
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1
Supply Voltage 5V
Terminal Pitch 1.27mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 28
JESD-30 Code R-PDSO-G28
Qualification Status Not Qualified
Operating Temperature (Max) 70°C
Supply Voltage-Max (Vsup) 9V
Power Supplies 4.5/8.0V
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 4.5V
Number of Channels 5
Analog IC - Other Type POWER SUPPLY SUPPORT CIRCUIT
Adjustable Threshold NO
Height Seated (Max) 2.64mm
Length 17.905mm
Width 7.5mm
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead

UCC3831DWP Overview


There is a SOIC package that includes this.At present, 5 channels are available.There are a total of 28 terminations on it.Device DUAL is located at the terminal position.There are a total of 28 pins on it.Hot-swappable device is possible to achieve high efficiency wHot-swappable deviceh a supply voltage of 5V.As far as Power Management Circuits is concerned, this gadget is self-contained.For normal operation, Vsup should be kept above 4.5V.9V (maximum supply voltage) is set.Part 4.5/8.0V is associated with power supplies.Hot Swap uses an analog IC, in this case a POWER SUPPLY SUPPORT CIRCUIT.

UCC3831DWP Features


The terminal position of 28

UCC3831DWP Applications


There are a lot of Texas Instruments UCC3831DWP hot swap controllers applications.

  • Other forms of communications infrastructure
  • Telecom server
  • Reverse current protection
  • Electric vehicle
  • Circuit breakers for electronic circuits
  • ISDN system
  • High power circuit board
  • Redundant Array of Disks (RAID)
  • Thermal limitation
  • Storage network

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